Power chips are attached to outside circuits with product packaging, and their performance relies on the support of the product packaging. In high-power scenarios, power chips are normally packaged as power components. Chip interconnection refers to the electrical connection on the top surface area of the chip, which is usually aluminum bonding wire in typical components. ^
Typical power module bundle cross-section

Presently, industrial silicon carbide power modules still mainly use the packaging innovation of this wire-bonded traditional silicon IGBT component. They encounter troubles such as large high-frequency parasitic parameters, not enough warmth dissipation ability, low-temperature resistance, and not enough insulation strength, which limit making use of silicon carbide semiconductors. The screen of exceptional efficiency. In order to resolve these problems and totally exploit the big potential advantages of silicon carbide chips, lots of brand-new product packaging technologies and solutions for silicon carbide power components have emerged over the last few years.

Silicon carbide power module bonding approach

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have actually established from gold wire bonding in 2001 to light weight aluminum cable (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have established from gold cables to copper wires, and the driving force is cost reduction; high-power devices have developed from light weight aluminum cables (strips) to Cu Clips, and the driving force is to improve product efficiency. The higher the power, the greater the needs.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that uses a strong copper bridge soldered to solder to attach chips and pins. Compared with conventional bonding product packaging techniques, Cu Clip technology has the adhering to advantages:

1. The connection in between the chip and the pins is made of copper sheets, which, to a particular degree, changes the common wire bonding method in between the chip and the pins. Consequently, a special package resistance worth, greater current circulation, and far better thermal conductivity can be acquired.

2. The lead pin welding location does not need to be silver-plated, which can totally conserve the expense of silver plating and inadequate silver plating.

3. The product appearance is entirely consistent with typical items and is mostly made use of in web servers, portable computer systems, batteries/drives, graphics cards, motors, power supplies, and various other areas.

Cu Clip has two bonding approaches.

All copper sheet bonding method

Both the Gate pad and the Resource pad are clip-based. This bonding approach is extra costly and complex, yet it can attain better Rdson and better thermal results.

( copper strip)

Copper sheet plus cord bonding method

The resource pad utilizes a Clip method, and the Gate makes use of a Cable technique. This bonding approach is somewhat more affordable than the all-copper bonding method, saving wafer area (appropriate to very little gateway areas). The procedure is simpler than the all-copper bonding method and can get much better Rdson and better thermal impact.

Provider of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper splashback, please feel free to contact us and send an inquiry.

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